Simulation of aging process of lead frame copper alloy by an artificial neural network

Juan Hua Su, Qi Ming Dong, Ping Liu, He Jun Li, Bu Xi Kang

科研成果: 期刊稿件文章同行评审

15 引用 (Scopus)

指纹

探究 'Simulation of aging process of lead frame copper alloy by an artificial neural network' 的科研主题。它们共同构成独一无二的指纹。

Engineering

Material Science