TY - GEN
T1 - Research on model based reliability system engineering methodology of system in package
AU - Su, Yutai
AU - Fu, Guicui
AU - Wang, Ye
AU - Leng, Hongyan
AU - Gu, Hantian
N1 - Publisher Copyright:
© 2017 IEEE.
PY - 2017/7/2
Y1 - 2017/7/2
N2 - With the rapid development of SiP technology, reliability problems on the SiP can not be resolved by single theories and traditional methods. This paper proposed a MBRSE methodology of SiP, describing requirement analysis, design, manufacturing, test and product acceptance of SiP. Some reliability models of SiP were provided as references, including data-driven models and PoF models. Finally, some directions for MBRSE of SiP were recommended to be researched.
AB - With the rapid development of SiP technology, reliability problems on the SiP can not be resolved by single theories and traditional methods. This paper proposed a MBRSE methodology of SiP, describing requirement analysis, design, manufacturing, test and product acceptance of SiP. Some reliability models of SiP were provided as references, including data-driven models and PoF models. Finally, some directions for MBRSE of SiP were recommended to be researched.
KW - Model Based Reliability System Engineering
KW - Reliability Models
KW - System in Package
UR - http://www.scopus.com/inward/record.url?scp=85050451024&partnerID=8YFLogxK
U2 - 10.1109/EDAPS.2017.8277030
DO - 10.1109/EDAPS.2017.8277030
M3 - 会议稿件
AN - SCOPUS:85050451024
T3 - 2017 IEEE Electrical Design of Advanced Packaging and Systems Symposium, EDAPS 2017
SP - 1
EP - 3
BT - 2017 IEEE Electrical Design of Advanced Packaging and Systems Symposium, EDAPS 2017
PB - Institute of Electrical and Electronics Engineers Inc.
T2 - 2017 IEEE Electrical Design of Advanced Packaging and Systems Symposium, EDAPS 2017
Y2 - 14 December 2017 through 16 December 2017
ER -