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西北工业大学 国内
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Modeling the failure of intermetallic/solder interfaces
Yao Yao
, Leon M. Keer, Morris E. Fine
ExxonMobil
Northwestern University
科研成果
:
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探究 'Modeling the failure of intermetallic/solder interfaces' 的科研主题。它们共同构成独一无二的指纹。
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Engineering
Intermetallics
100%
Joints (Structural Components)
100%
Creep
42%
Finite Element Modeling
28%
Eutectics
28%
Interconnects
28%
Crack Tip
28%
High Current Density
28%
Free Solder
28%
Thermoelectricity
28%
Resistance Heating
28%
Finite Element Analysis
14%
Melting Point
14%
Hysteresis Effect
14%
Failure Mode
14%
Density Distribution
14%
Plasticity Theory
14%
Joule Heating Effect
14%
Brittle Fracture
14%
Melting Temperature
14%
Mechanical Problem
14%
Electronics Industry
14%
Ball Grid Arrays
14%
Mechanical Fracture
14%
Integrated Circuit
14%
Interfacial Damage
14%
Material Science
Mechanical Fracture
16%