Mining High-order Multimodal Brain Image Associations via Sparse Tensor Canonical Correlation Analysis

Lei Du, Jin Zhang, Fang Liu, Minjianan Zhang, Huiai Wang, Lei Guo, Junwei Han

科研成果: 书/报告/会议事项章节会议稿件同行评审

3 引用 (Scopus)

摘要

Neuroimaging techniques have shown increasing power to understand the neuropathology of brain disorders. Multimodal brain imaging data carry distinct but complementary information and thus could depict brain disorders comprehensively. To deepen our understanding, it is essential to investigate the intrinsic associations among multiple modalities. To date, the pairwise correlations between imaging data captured by different imaging modalities have been well studied, leaving formidable challenges to identify high-order associations. In this paper, we first propose a new sparse tensor canonical correlation analysis (STCCA) with feature selection to analyze the complex high-order relationships among multimodal brain imaging data. In addition, we find that methods for identifying pairwise associations and high-order associations have complementary advantages, providing a sound reason to fuse them. Therefore, we further propose an improved STCCA (STCCA^{+}) which integrates STCCA and sparse multiple CCA (SMCCA) to fully uncover associations among multiple imaging modalities. The proposed STCCA^{+} detects equivalent association levels among multimodal imaging data compared to SMCCA. Most importantly, both STCCA and STCCA^{+} yield modality-consistent imaging markers and modality-specific ones, assuring a better and meaningful feature selection capability. Finally, the identified imaging markers and their high-order correlations could form a comprehensive indication of brain disorders, showing their promise in highorder multimodal brain imaging analysis.

源语言英语
主期刊名Proceedings - 2020 IEEE International Conference on Bioinformatics and Biomedicine, BIBM 2020
编辑Taesung Park, Young-Rae Cho, Xiaohua Tony Hu, Illhoi Yoo, Hyun Goo Woo, Jianxin Wang, Julio Facelli, Seungyoon Nam, Mingon Kang
出版商Institute of Electrical and Electronics Engineers Inc.
570-575
页数6
ISBN(电子版)9781728162157
DOI
出版状态已出版 - 16 12月 2020
活动2020 IEEE International Conference on Bioinformatics and Biomedicine, BIBM 2020 - Virtual, Seoul, 韩国
期限: 16 12月 202019 12月 2020

出版系列

姓名Proceedings - 2020 IEEE International Conference on Bioinformatics and Biomedicine, BIBM 2020

会议

会议2020 IEEE International Conference on Bioinformatics and Biomedicine, BIBM 2020
国家/地区韩国
Virtual, Seoul
时期16/12/2019/12/20

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