Microstructure growth kinetics and mechanical property improvement of directionally solidified Al-4.5 %Cu-4.5 %Si ternary alloy

X. Wang, J. Y. Wang, W. Zhai

科研成果: 期刊稿件文章同行评审

指纹

探究 'Microstructure growth kinetics and mechanical property improvement of directionally solidified Al-4.5 %Cu-4.5 %Si ternary alloy' 的科研主题。它们共同构成独一无二的指纹。

Engineering

Material Science