Microstructure evolution at the diffusion bonding interface of high Nb containing TiAl alloy

Xian Sheng Qi, Xiang Yi Xue, Bin Tang, Chuan Yun Wang, Hong Chao Kou, Jin Shan Li

科研成果: 书/报告/会议事项章节会议稿件同行评审

3 引用 (Scopus)

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Material Science

Engineering