Microstructure evolution and room temperature fracture toughness of an integrally directionally solidified Nb-Ti-Si based ultrahigh temperature alloy

Haisheng Guo; Xiping Guo

doi:10.1016/j.scriptamat.2010.12.008

Microstructure evolution and room temperature fracture toughness of an integrally directionally solidified Nb-Ti-Si based ultrahigh temperature alloy

Haisheng Guo, Xiping Guo

材料学院

Northwestern Polytechnical University Xian

科研成果: 期刊稿件 › 文章 › 同行评审

124 引用（Scopus）

摘要

Integrally directional solidification of an Nb-Ti-Si based ultrahigh temperature alloy was performed at 2000 °C with withdrawal rates varying from 2.5 to 100 μm s^-1. The directionally solidified microstructure was composed of primary silicides and eutectic colonies that distributed evenly and aligned erectly along the growth direction. Both the average diameter and the lamellar spacing of eutectic cells decreased with increasing withdrawal rate. The room temperature fracture toughness was improved significantly by integrally directional solidification.

源语言	英语
页（从-至）	637-640
页数	4
期刊	Scripta Materialia
卷	64
期	7
DOI	https://doi.org/10.1016/j.scriptamat.2010.12.008
出版状态	已出版 - 4月 2011

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title = "Microstructure evolution and room temperature fracture toughness of an integrally directionally solidified Nb-Ti-Si based ultrahigh temperature alloy",

abstract = "Integrally directional solidification of an Nb-Ti-Si based ultrahigh temperature alloy was performed at 2000 °C with withdrawal rates varying from 2.5 to 100 μm s-1. The directionally solidified microstructure was composed of primary silicides and eutectic colonies that distributed evenly and aligned erectly along the growth direction. Both the average diameter and the lamellar spacing of eutectic cells decreased with increasing withdrawal rate. The room temperature fracture toughness was improved significantly by integrally directional solidification.",

keywords = "Directional solidification, Fracture toughness, Nb-Ti-Si based alloy, Solidification microstructure",

author = "Haisheng Guo and Xiping Guo",

year = "2011",

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doi = "10.1016/j.scriptamat.2010.12.008",

language = "英语",

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AU - Guo, Haisheng

AU - Guo, Xiping

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N2 - Integrally directional solidification of an Nb-Ti-Si based ultrahigh temperature alloy was performed at 2000 °C with withdrawal rates varying from 2.5 to 100 μm s-1. The directionally solidified microstructure was composed of primary silicides and eutectic colonies that distributed evenly and aligned erectly along the growth direction. Both the average diameter and the lamellar spacing of eutectic cells decreased with increasing withdrawal rate. The room temperature fracture toughness was improved significantly by integrally directional solidification.

AB - Integrally directional solidification of an Nb-Ti-Si based ultrahigh temperature alloy was performed at 2000 °C with withdrawal rates varying from 2.5 to 100 μm s-1. The directionally solidified microstructure was composed of primary silicides and eutectic colonies that distributed evenly and aligned erectly along the growth direction. Both the average diameter and the lamellar spacing of eutectic cells decreased with increasing withdrawal rate. The room temperature fracture toughness was improved significantly by integrally directional solidification.

KW - Directional solidification

KW - Fracture toughness

KW - Nb-Ti-Si based alloy

KW - Solidification microstructure

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DO - 10.1016/j.scriptamat.2010.12.008

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SN - 1359-6462

VL - 64

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JO - Scripta Materialia

JF - Scripta Materialia

IS - 7

ER -

Microstructure evolution and room temperature fracture toughness of an integrally directionally solidified Nb-Ti-Si based ultrahigh temperature alloy

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