Microstructure and Properties of C/SiC-Diamond Composites Prepared by the Combination of CVI and RMI

Jingxin Li, Yongsheng Liu, Beiya Nan, Zhifeng Zhao, Wei Feng, Qing Zhang, Laifei Cheng

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23 引用 (Scopus)

摘要

Diamond modified continuous carbon fiber reinforced silicon carbide (C/SiC-Diamond) composites are prepared using a combination of chemical vapor infiltration (CVI) and reactive melt infiltration (RMI). The effect of the diamond particle size on the microstructure, mechanical properties, and thermophysical properties of C/SiC-Diamond composites are investigated. A density of 2.05 g cm−3 is achieved for C/SiC-Diamond composites impregnated with 1 µm diamond particles. A near twofold enhancement of the thermal conductivity (9–10 W (m K)−1) and thermal diffusion coefficient (5 mm2 s−1) is obtained, compared with continuous carbon fiber reinforced silicon carbide (C/SiC) composites (5–6 W (m · K)−1) prepared by CVI. It is established that the introduction of diamond can improve the thermal conductivity of C/SiC composites and increase the application potential in rocket engines, aerospace vehicles, and brake materials.

源语言英语
文章编号1800765
期刊Advanced Engineering Materials
21
5
DOI
出版状态已出版 - 5月 2019

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