Microstructural characteristics and mechanical properties of peritectic Cu-Sn alloy solidified within ultrasonic field

W. Zhai, Z. Y. Hong, X. L. Wen, D. L. Geng, B. Wei

科研成果: 期刊稿件 › 文章 › 同行评审

43 引用 （Scopus）

指纹

探究 'Microstructural characteristics and mechanical properties of peritectic Cu-Sn alloy solidified within ultrasonic field' 的科研主题。它们共同构成独一无二的指纹。

Material Science

Engineering

Physics