@inproceedings{81777eff5f244c41bc2acd66af3dab0c,
title = "Mechanical Behavior of Lead-free Solder at High Temperatures and High Strain Rates",
abstract = "While moving ahead with science and technology., the service conditions of microelectronic devices are becoming more and more complicated., and the performance requirements of packaging materials are also increasing especially for hash applications. The dependability of solder joints in electronic chips under high temperatures and high strain rates have attracted much attention. In this paper., experimental studies are carried out on the dynamic behavior of Sn-3.0Ag-0.5Cu (SAC305) materials. The dynamic compression experiments are operated by using the Split-Hopkinson Pressure Bar (SHPB) with a heating furnace to achieve the target temperature condition. The true stress- strain curves are received by this system at a temperature of 343K and the strain rates from 959 mathrms-1 to 1961 mathrms-1. Additionally., in order to investigate the deformation mechanism under impact scenarios., an optical microscopy is utilized to characterize the microstructure of the SAC305 lead-free solder specimen at high temperatures and high strain rates.",
keywords = "Dynamic, microstructure, SHPB, strain rate, temperature",
author = "Xu Long and Tianxiong Su and Chao Chang and Jiaqiang Huang and Xiaotong Chang and Yutai Su and Hongbin Shi and Tao Huang and Yanpei Wu",
note = "Publisher Copyright: {\textcopyright} 2021 IEEE.; 22nd International Conference on Electronic Packaging Technology, ICEPT 2021 ; Conference date: 14-09-2021 Through 17-09-2021",
year = "2021",
month = sep,
day = "14",
doi = "10.1109/ICEPT52650.2021.9568200",
language = "英语",
series = "2021 22nd International Conference on Electronic Packaging Technology, ICEPT 2021",
publisher = "Institute of Electrical and Electronics Engineers Inc.",
booktitle = "2021 22nd International Conference on Electronic Packaging Technology, ICEPT 2021",
}