Mechanical and electronic properties of Ti-7333 alloy under tension: First-principles calculations
Dan Hong, Wei Zeng, Fu Sheng Liu, Bin Tang, Qi Jun Liu
科研成果: 期刊稿件 › 文章 › 同行评审
Dan Hong, Wei Zeng, Fu Sheng Liu, Bin Tang, Qi Jun Liu
科研成果: 期刊稿件 › 文章 › 同行评审