Mechanical and electrical performances of ternary Cu-2.8%Ni-0.7%Si alloy modulated by ultrasonic solidification

Qian Zhou, Yajie Hu, Jianyuan Wang, Wei Zhai, Bingbo Wei

科研成果: 期刊稿件文章同行评审

3 引用 (Scopus)

指纹

探究 'Mechanical and electrical performances of ternary Cu-2.8%Ni-0.7%Si alloy modulated by ultrasonic solidification' 的科研主题。它们共同构成独一无二的指纹。

Material Science