Machinability of elliptical ultrasonic vibration milling γ-TiAl: Chip formation, edge breakage, and subsurface layer deformation

Ziwen XIA, Chenwei SHAN, Menghua ZHANG, Wengang LIU, Minchao CUI, Ming LUO

科研成果: 期刊稿件 › 文章 › 同行评审

4 引用 （Scopus）

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Material Science

Engineering