Kinetics of triple-junctions in eutectic solidification: a sharp interface model

Haifeng Wang, Feng Liu, D. M. Herlach

科研成果: 期刊稿件文章同行评审

10 引用 (Scopus)

摘要

The kinetics of triple-junctions (TJs) in eutectic solidification is modeled by the thermodynamic extremum principle (TEP). It consists of two parts. First, TJs as the interaction of interfaces follow the interface kinetics according to which the temperature and concentration at the TJs are determined. This interface part of TJ kinetics is closely related to the eutectic point in the kinetic phase diagram. Second, TJs have their specific kinetics according to which their morphology (e.g., the contact angles in two dimensions) is determined. Using a new solution of solute diffusion in liquid, the TJ kinetics is incorporated into the current lamellar eutectic growth model. The model is applicable to the concentrated alloy systems and can be extended to any kind of eutectics. Simulation results of the rapid solidification of a lamellar Ni5Si2–Ni2Si (γ–δ) eutectic show that both parts of TJ kinetics can play important roles in eutectic solidification and need to be considered to improve the current eutectic theory.

源语言英语
页(从-至)176-188
页数13
期刊Journal of Materials Science
50
1
DOI
出版状态已出版 - 1 1月 2015

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