TY - GEN
T1 - High Temperature Surface Acoustic Wave Sensor with Strain Isolation Structure
AU - Pei, Guangyao
AU - Ma, Binghe
AU - Luo, Jian
AU - Deng, Jinjun
N1 - Publisher Copyright:
© 2021 IEEE.
PY - 2021/6/20
Y1 - 2021/6/20
N2 - This paper presents a high temperature surface acoustic wave (SAW) sensor with less strain sensitivity. To realize more accurate temperature measurement, a strain isolation structure is designed to alleviate the transfer of inevitable substrate strain to the sensing unit. Langasite (LGS) piezoelectric substrate and composite film electrode are used to ensure the high temperature stability of the sensor. FEA simulation shows the strain isolation effect of the presented structure. Compared with the ordinary sensor, the strain sensitivity of the presented sensor is reduced from 0.1761 to 0.0025 kHz/us. The output presents a quadratic function relationship with temperature in 80-850°C, and an error of less than 5%. is achieved.
AB - This paper presents a high temperature surface acoustic wave (SAW) sensor with less strain sensitivity. To realize more accurate temperature measurement, a strain isolation structure is designed to alleviate the transfer of inevitable substrate strain to the sensing unit. Langasite (LGS) piezoelectric substrate and composite film electrode are used to ensure the high temperature stability of the sensor. FEA simulation shows the strain isolation effect of the presented structure. Compared with the ordinary sensor, the strain sensitivity of the presented sensor is reduced from 0.1761 to 0.0025 kHz/us. The output presents a quadratic function relationship with temperature in 80-850°C, and an error of less than 5%. is achieved.
KW - High temperature SAW sensor
KW - strain isolation structure
KW - strain loading experiment
KW - substrate strain interference
KW - temperature sensing experiment
UR - http://www.scopus.com/inward/record.url?scp=85114960936&partnerID=8YFLogxK
U2 - 10.1109/Transducers50396.2021.9495398
DO - 10.1109/Transducers50396.2021.9495398
M3 - 会议稿件
AN - SCOPUS:85114960936
T3 - 21st International Conference on Solid-State Sensors, Actuators and Microsystems, TRANSDUCERS 2021
SP - 1194
EP - 1197
BT - 21st International Conference on Solid-State Sensors, Actuators and Microsystems, TRANSDUCERS 2021
PB - Institute of Electrical and Electronics Engineers Inc.
T2 - 21st International Conference on Solid-State Sensors, Actuators and Microsystems, TRANSDUCERS 2021
Y2 - 20 June 2021 through 25 June 2021
ER -