High-Precision Probabilistic Imaging for Interface Debonding Monitoring Based on Electromechanical Impedance

Fei Du, Guanghao Wang, Jiexin Weng, Haodong Fan, Chao Xu

科研成果: 期刊稿件 › 文章 › 同行评审

3 引用 （Scopus）

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Engineering

Material Science