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西北工业大学 国内
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High-performance polyimide nanocomposites with core-shell AgNWs@BN for electronic packagings
Yongcun Zhou,
Feng Liu
材料学院
Northwestern Polytechnical University Xian
科研成果
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分类
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Engineering
Thermal Conductivity
100%
Nanocomposite
100%
Core-Shell
100%
Electronic Packaging
100%
Nitride
75%
Nanowire
50%
Nanomaterial
25%
Silicon Dioxide
25%
One Dimensional
25%
Dielectrics
25%
Dielectric Loss
25%
High Electrical Conductivity
25%
High Aspect Ratio
25%
Polymer Matrix
25%
Shells (Structures)
25%
Relative Permittivity
25%
Interfacial Interaction
25%
Nanolayers
25%
Material Science
Nanocomposite
100%
Polyimide
100%
Thermal Conductivity
57%
Boron Nitride
42%
Composite Material
28%
Permittivity
28%
Nanowire
28%
Density
14%
Electrical Conductivity
14%
Dielectric Material
14%
Dielectric Property
14%
Nanostructure
14%
Polymer Matrix
14%
Chemical Engineering
Polyimide
100%
Thermal Conductivity
57%
Boron Nitride
42%
Nanowire
28%
Nanostructure
14%