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西北工业大学 国内
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Heterogeneity-induced thermal mismatch in BGA interconnects: Insights from mechanical-thermal finite element modeling
Liu Chu, Jiajia Shi,
Xu Long
力学与土木建筑学院
ShanghaiTech University
Nantong University
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Engineering
Interconnects
100%
Fem Model
100%
Ball Grid Arrays
100%
Finite Element Modeling
60%
Thermal Gradient
40%
Creep
40%
Printed Circuit Board
40%
Illustrates
20%
Creep Strain
20%
System State
20%
Intrinsic Property
20%
Central Region
20%
Fatigue Failure
20%
Nonlinear Analysis
20%
Thermal Diffusion
20%
Electronic Packaging
20%
Potential Failure
20%
Study Material
20%
Underfill
20%
Material Science
Finite Element Modeling
100%
Creep
50%
Thermal Cycling
50%
Electronic Circuit
50%
Thermal Expansion
25%
Creep Property
25%
Thermal Diffusion
25%
Heterogeneous Material
25%
Viscoplastic Behavior
25%
Earth and Planetary Sciences
Electronic Packaging
50%