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西北工业大学 国内
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Exploring modeling and testing approaches for three-dimensional integrated thermal resistance of chiplets
Ruyue Shang, Yue Yao, Antong Bi, Yucheng Wang,
Shaoxi Wang
微电子学院
Northwestern Polytechnical University Xian
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Engineering
Comparative Analysis
20%
Finite Element Analysis
20%
Finite Element Simulation
20%
Heat Resistance
100%
Heat Transfer Analysis
20%
Hot Spot
40%
Plastics Applications
40%
Potential Source
20%
Reference Value
20%
Reliable Operation
20%
Repeatability
20%
Resistance Test
20%
Simulation Model
20%
Temperature Profile
20%
Test Method
20%
Thermal Conductivity
40%
Thermal Simulation
40%
Material Science
Design Principle
20%
Finite Element Method
40%
Heat Resistance
100%
Packaging Material
40%
Thermal Analysis
20%
Thermal Conductivity
40%
Earth and Planetary Sciences
Heat Sink
20%
Thermal Simulation
40%