Evolution mechanism of interfacial multi-layer intermetallic compounds and failure behavior in the Al–Au wire bonding

Engineering

• Intermetallics 100%
• Failure Behavior 100%
• Bonding Wire 100%
• Thermal Cycle 50%
• Thermal Energy Storage 50%
• Compound Layer 50%
• Thermal Stress 37%
• Barrier Layer 37%
• Layer Interface 25%
• Plastic Deformation 12%
• Stored Energy 12%
• Crack Propagation 12%
• Interfacial Energy 12%
• Initial Crack 12%
• Kirkendall Effect 12%
• Bond Strength 12%
• Driving Force 12%
• Cyclic Stress 12%
• Thick Layer 12%
• Form Void 12%