Enhancement of the Unified Constitutive Model for Viscoplastic Solders in Wide Strain Rate and Temperature Ranges

W. J. Wang, X. Long, C. Y. Du, Y. H. Fu, Y. Yao, Y. P. Wu

科研成果: 期刊稿件 › 文章 › 同行评审

11 引用 （Scopus）

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Engineering

Material Science