摘要
In this letter, an enhanced transmission structure with high-directivity radiation through a single slit in a 1.5-mm-thick Teflon circuit board material surrounded by arrays of parallel metallic patches and via-holes is reported. The proposed structure is based on the composite right/left-handed transmission-line microstrip technology. The radiation principle is analyzed by employing transmission-line dispersion relation. High-directivity radiation is observed at the frequency where enhanced transmission occurs. The experimental results are consistent with the theoretical prediction.
| 源语言 | 英语 |
|---|---|
| 文章编号 | 5928380 |
| 页（从-至） | 658-661 |
| 页数 | 4 |
| 期刊 | IEEE Antennas and Wireless Propagation Letters |
| 卷 | 10 |
| DOI | |
| 出版状态 | 已出版 - 2011 |