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西北工业大学 国内
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Energy-based micromechanics analysis on fatigue crack propagation behavior in Sn-Ag eutectic solder
Yao Yao
, Semyon Vaynman, Leon M. Keer, Morris E. Fine
Northwestern University
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探究 'Energy-based micromechanics analysis on fatigue crack propagation behavior in Sn-Ag eutectic solder' 的科研主题。它们共同构成独一无二的指纹。
分类
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Engineering
Eutectics
100%
Fatigue Crack Propagation
100%
Micromechanics
100%
Creep
50%
Finite Element Analysis
25%
Intermetallics
25%
Experimental Result
25%
Fracture Mechanics
25%
Stress-Intensity Factor
25%
Hysteresis Effect
25%
Plasticity Theory
25%
Cohesive Zone Model
25%
Fatigue Crack Nucleation
25%
Electronics Industry
25%
Fatigue Crack Propagation Rate
25%
Material Science
Fatigue Crack
100%
Crack Propagation
100%
Micromechanics
100%
Creep
40%
Finite Element Method
20%
Intermetallics
20%
Nucleation
20%
Fracture Mechanics
20%
Stress Intensity Factor
20%
Plasticity Theory
20%
Cohesive Zone Model
20%