Effect of Temperature and Grain Boundary on Void Evolution in Irradiated Copper: A Phase-Field Study

Qionghuan Zeng, Yiming Chen, Zhongsheng Yang, Yunhao Huang, Zhijun Wang, Junjie Li, Jincheng Wang

科研成果: 期刊稿件 › 文章 › 同行评审

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Material Science