Effect of Surface Stress on Indentation Response of Elastic-Plastic Materials

Xu Long, Ziyi Shen, Xiaotong Chang, Yutai Su, Hongbin Shi, Tao Huang, Yanpei Wu, Bingyi Tu

科研成果: 书/报告/会议事项章节会议稿件同行评审

1 引用 (Scopus)

摘要

In this study, nanoindentation technology is applied to evaluate the elastic-plastic law of mechanical properties of small-sized in-situ packaging materials. As one of the most appealing advantage, the proposed method requires only a single nanoindentation, which means the nanoindentation experiments can be performed at minor effort. Combined with nanoindentation technology, the mechanical behavior of packaging materials in single-point nanoindentation loading process was simulated by the finite element method. The effect of surface stress on nanoindentation was studied numerically. In the finite element simulations, after applying prestress to the substrate material, the single-point nanoindentation was numerically analyzed up to the same indentation depth. Based on the finite element predictions, the mechanical properties of materials subjected to prestressing in different directions are studied. By comparing the applied load-penetration depth curves, stress contour, plastic zone and pile-up behavior, the influence of surface stress on the elastic-plastic material is elucidated.

源语言英语
主期刊名2021 22nd International Conference on Electronic Packaging Technology, ICEPT 2021
出版商Institute of Electrical and Electronics Engineers Inc.
ISBN(电子版)9781665413916
DOI
出版状态已出版 - 14 9月 2021
活动22nd International Conference on Electronic Packaging Technology, ICEPT 2021 - Xiamen, 中国
期限: 14 9月 202117 9月 2021

出版系列

姓名2021 22nd International Conference on Electronic Packaging Technology, ICEPT 2021

会议

会议22nd International Conference on Electronic Packaging Technology, ICEPT 2021
国家/地区中国
Xiamen
时期14/09/2117/09/21

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