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Effect of deep cryogenic treatment on mechanical properties and microstructure of Sn3.0Ag0.5Cu solder
Yao Yao
, Xiao Li, Xu He
力学与土木建筑学院
Northwestern Polytechnical University Xian
科研成果
:
期刊稿件
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11
引用 (Scopus)
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探究 'Effect of deep cryogenic treatment on mechanical properties and microstructure of Sn3.0Ag0.5Cu solder' 的科研主题。它们共同构成独一无二的指纹。
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Engineering
Ultimate Tensile Strength
100%
Dislocation Density
100%
Constitutive Model
50%
Intermetallics
50%
Experimental Result
50%
Good Agreement
50%
Joints (Structural Components)
50%
High Dislocation Density
50%
Yield Point
50%
Room Temperature
50%
Eutectics
50%
Internal Stress
50%
Concentration Difference
50%
Creep
50%
Fatigue Resistance
50%
Past Decade
50%
High Cooling Rate
50%
Material Science
Density
100%
Ultimate Tensile Strength
66%
Intermetallics
33%
Creep
33%
Fatigue of Materials
33%
Yield Stress
33%
Wear Resistance
33%
Solder Joint
33%
Chemical Engineering
Cryogenics
100%