Effect of current on the growth of intermetallic compounds in Sn-3.0Ag-0.5Cu solder joints

Bofeng Li, Jundong Wang, Yao Yao

科研成果: 书/报告/会议事项章节 › 会议稿件 › 同行评审

指纹

探究 'Effect of current on the growth of intermetallic compounds in Sn-3.0Ag-0.5Cu solder joints' 的科研主题。它们共同构成独一无二的指纹。

Engineering

Material Science