Effect of curing pressure on the curing behavior of an epoxy system: Curing kinetics and simulation verification

Qun Liang, Xi Ping Feng, Kun Zhang, Xue Mei Hui, Xiao Hou, Jin Rui Ye

科研成果: 期刊稿件 › 文章 › 同行评审

15 引用 （Scopus）

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Engineering

Material Science