摘要
Through the investigations of the measurement method and the thermal balance of the micro thermal sensor device structure, it is improved to use the heat rating of each part of the device and the device signal to noise ratio (SNR) as the emulation and calculation goal to design the dimensions of the structure. Through vising ANSYS software analyzing the structure substrate with and without cavity and with vacuum cavity, comparing the calculation result of the heat rating of each part and device SNR in three cases, and analyzing different depths of vacuum cavity in the substrate, the optimization result of the micro thermal sensor device structure dimension is obtained.
| 源语言 | 英语 |
|---|---|
| 页（从-至） | 476-480 |
| 页数 | 5 |
| 期刊 | Hangkong Xuebao/Acta Aeronautica et Astronautica Sinica |
| 卷 | 28 |
| 期 | 2 |
| 出版状态 | 已出版 - 3月 2007 |