Deformation behavior and microstructural evolution during the semi-solid compression of Al-4Cu-Mg alloy

Yalin Lu, Miaoquan Li, Weichao Huang, Haitao Jiang

科研成果: 期刊稿件文章同行评审

18 引用 (Scopus)

摘要

The effects of the process parameters, including deformation temperature and strain rate, on the deformation behavior and microstructure of an Al-4Cu-Mg alloy, have been investigated through isothermal compression. Experiments were conducted at deformation temperatures of 540 °C, 560 °C, and 580 °C, strain rates of 1 s-1, 1×10-1 s-1, 1×10-2 s-1, and 1×10-3 s -1, and height reductions of 20%, 40%, and 60%. The experimental results show that deformation temperature and strain rate have significant effect on the peak flow stress. The flow stress decreases with an increase of deformation temperature and/or a decrease of the strain rate. Above a critical value of the deformation temperature, the flow stress quickly reaches a steady value. Experimental materials A and B have equiaxed and irregular grains, respectively, prior to deformation. The microstructures vary with the process parameters in the semi-solid state. For material B, the irregular grains transform to equiaxed grains in the process of semi-solid deformation, which improves the deformation behavior.

源语言英语
页(从-至)423-430
页数8
期刊Materials Characterization
54
4-5
DOI
出版状态已出版 - 5月 2005

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