Cracking mechanism of CdZnTe polycrystalline film deposited on TFT circuit board at high temperature by close-spaced sublimation method

Yiwei Li, Wenyu Zhang, Kun Cao, Yang Li, Gangqiang Zha, Tingting Tan

科研成果: 期刊稿件 › 文章 › 同行评审

3 引用 （Scopus）

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Engineering

Material Science

Physics