Constitutive behaviour and life evaluation of solder joint under the multi-field loadings

Xu Long, Yongchao Liu, Yao Yao, Fengrui Jia, Cheng Zhou, Yonghui Fu, Yanpei Wu

科研成果: 期刊稿件 › 文章 › 同行评审

29 引用 （Scopus）

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Engineering

Material Science