Cellular automata simulation of dynamic recrystallization in rotary friction welding of pure copper

Jiangtao Xiong, Wei Zhou, Limin Wang, Jinglong Li, Fusheng Zhang

科研成果: 期刊稿件文章同行评审

2 引用 (Scopus)

摘要

The cellular automata method was introduced to simulate dynamic recrystallization process in rotary friction welding of pure copper, in which the microstructure evolution under different friction welding parameters were simulated. The simulated grain size was well matched with the experiments and the dynamic recrystallization time was comparable to the welding time, which verified the reliability of this model. The relationship between the simulated recrystallized grain size ds and the Zener-Hollomon parameter can be regressed as ds=5.44-0.11lnZ.

源语言英语
页(从-至)377-382
页数6
期刊Indian Journal of Engineering and Materials Sciences
24
5
出版状态已出版 - 10月 2017

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