摘要
The cellular automata method was introduced to simulate dynamic recrystallization process in rotary friction welding of pure copper, in which the microstructure evolution under different friction welding parameters were simulated. The simulated grain size was well matched with the experiments and the dynamic recrystallization time was comparable to the welding time, which verified the reliability of this model. The relationship between the simulated recrystallized grain size ds and the Zener-Hollomon parameter can be regressed as ds=5.44-0.11lnZ.
源语言 | 英语 |
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页(从-至) | 377-382 |
页数 | 6 |
期刊 | Indian Journal of Engineering and Materials Sciences |
卷 | 24 |
期 | 5 |
出版状态 | 已出版 - 10月 2017 |