Analysis of flow and thermal performance of a water-cooled transversal wavy microchannel heat sink for chip cooling

Engineering

• Cooling Capacity 11%
• Heat Flux 11%
• Integrated Circuit 11%
• Laminar Flows 11%
• Liquid Cooling 11%
• Microchannel 100%
• Output Power 11%
• Pressure Drop 22%
• Rectangular Cross Section 22%
• Rectangular Microchannel 11%
• Reynolds' Number 11%
• Thermal Load 11%
• Thermal Performance 100%