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西北工业大学 国内
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An advanced constitutive model for SnPb and SnAg solder materials
Xu He,
Yao Yao
力学与土木建筑学院
Northwestern Polytechnical University Xian
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探究 'An advanced constitutive model for SnPb and SnAg solder materials' 的科研主题。它们共同构成独一无二的指纹。
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Engineering
Accumulation Process
33%
Constitutive Model
100%
Continuum Mechanics
33%
Creep
33%
Damage Accumulation
100%
Dependent Behavior
33%
Electronics Industry
33%
Eutectics
100%
Fatigue Life
33%
Fatigue Loading
33%
Finite Element Analysis
33%
Free Solder
33%
Joints (Structural Components)
66%
Kinematic Hardening
33%
Mechanical Damage
33%
Melting Point
33%
Melting Temperature
33%
Past Decade
33%
Peak Stress
33%
Strain Relationship
33%
Material Science
Continuum Mechanics
50%
Creep
50%
Fatigue of Materials
50%
Finite Element Method
50%
Lead-Free Solder
50%
Solder Joint
100%