A nanostructured Ag/Cu multilayered composite exhibiting high hardness and high electrical conductivity prepared by a novel multicomponent accumulative roll bonding

Hao Dong, Yuzeng Chen, Yongchun Guo, Guibin Shan, Guoyu Yang, Linke Huang, Feng Liu, Qian Li

科研成果: 期刊稿件 › 文章 › 同行评审

13 引用 （Scopus）

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Engineering

Material Science