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西北工业大学 国内
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A coupled thermo-electrical finite element analysis of Pb-free solder joints with interfacial crack propagation
Yao Yao
, Leon M. Keer
ExxonMobil
Northwestern University
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探究 'A coupled thermo-electrical finite element analysis of Pb-free solder joints with interfacial crack propagation' 的科研主题。它们共同构成独一无二的指纹。
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Engineering
Finite Element Analysis
100%
Joints (Structural Components)
100%
Crack Propagation
100%
Crack Tip
100%
Free Solder
100%
Thermoelectricity
100%
Interfacial Crack
100%
Intermetallics
66%
Melting Point
33%
Density Distribution
33%
Joule Heating Effect
33%
High Current Density
33%
Melting Temperature
33%
Resistance Heating
33%
Material Science
Density
100%
Finite Element Method
100%
Crack Tip
100%
Crack Propagation
100%
Lead-Free Solder
100%
Solder Joint
100%
Intermetallics
66%
Thermal Conductivity
33%
Electrical Conductivity
33%
Electronic Circuit
33%