电磁加载膨胀环试验技术的发展及应用

Zongxing Liu, Chunyang Zhang, Miao Cao, Feiying Chen, Jun Liu, Yulong Li

科研成果: 期刊稿件文献综述同行评审

摘要

Electromagnetic loading expansion ring test technology is an important means to achieve high strain rate tensile loading, capable of achieving strain rates on the order of 104 s−1 for one-dimensional tensile loading. Electromagnetic Lorentz forces are uniformly applied to the expansion ring specimens as a body force, and the dynamic loading process does not involve stress wave propagation effects. Moreover, the characteristic structure of the ring specimens avoids the end grip effects seen with traditional dog-bone-shaped specimens. Therefore, electromagnetic loading expansion ring test technology is widely used in the study of the tensile mechanical behavior of materials at high strain rates. This paper first introduces the basic principles of dynamic loading expansion ring test technology, then discusses the disadvantages of explosion-driven expansion ring test technology and the advantages of electromagnetic-driven expansion ring test technology, and reviews the development history of electromagnetic loading expansion ring test technology. It then summarizes the cutting-edge research progress of electromagnetic loading expansion ring test technology in the dynamic mechanical properties of materials, dynamic fracture behavior, dynamic ductile behavior, and high-temperature adiabatic properties. Finally, it discusses the development prospects and directions of electromagnetic loading expansion ring test technology in the field of solid mechanics. This provides a relatively systematic reference for researchers engaged in the experimental technology field of dynamic mechanical behavior of materials and offers a comprehensive and systematic knowledge of the field for young researchers interested in electromagnetic loading expansion ring test technology.

投稿的翻译标题Development and application of electromagnetic loading expansion ring test technology
源语言繁体中文
页(从-至)639-668
页数30
期刊Advances in Mechanics
54
4
DOI
出版状态已出版 - 2024

关键词

  • dynamic ductility behavior
  • dynamic fracture behavior
  • electromagnetic loading
  • expansion ring
  • high strain rate
  • high temperature insulation performance
  • tensile mechanical behavior

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