每年的科研成果
每年的科研成果
搜索结果
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2023
Effect of current on the growth of intermetallic compounds in Sn-3.0Ag-0.5Cu solder joints
Li, B., Wang, J. & Yao, Y., 2023, 2023 24th International Conference on Electronic Packaging Technology, ICEPT 2023. Institute of Electrical and Electronics Engineers Inc., (2023 24th International Conference on Electronic Packaging Technology, ICEPT 2023).科研成果: 书/报告/会议事项章节 › 会议稿件 › 同行评审
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2018
Aging effect on defect evolution and shear strength of nano-silver solder joint
Gong, H., Yao, Y., Wang, J., Wang, S. & Long, X., 2 10月 2018, Proceedings - 2018 19th International Conference on Electronic Packaging Technology, ICEPT 2018. Xiao, F., Wang, J., Chen, L. & Ye, T. (编辑). Institute of Electrical and Electronics Engineers Inc., 页码 867-871 5 页码 8480660. (Proceedings - 2018 19th International Conference on Electronic Packaging Technology, ICEPT 2018).科研成果: 书/报告/会议事项章节 › 会议稿件 › 同行评审
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2017
Effects of aging temperature on fatigue life of Sn-3.0Ag-0.5Cu solder joints
Wang, J. & Yao, Y., 19 9月 2017, 18th International Conference on Electronic Packaging Technology, ICEPT 2017. Wang, C., Tian, Y. & Ye, T. (编辑). Institute of Electrical and Electronics Engineers Inc., 页码 421-425 5 页码 8046485. (18th International Conference on Electronic Packaging Technology, ICEPT 2017).科研成果: 书/报告/会议事项章节 › 会议稿件 › 同行评审