Thermal expansion and thermal diffusivity properties of Co-Si solid solutions and intermetallic compounds

Ying Ruan, Liuhui Li, Qianqian Gu, Kai Zhou, Na Yan, Bingbo Wei

Research output: Contribution to journalArticlepeer-review

4 Scopus citations

Fingerprint

Dive into the research topics of 'Thermal expansion and thermal diffusivity properties of Co-Si solid solutions and intermetallic compounds'. Together they form a unique fingerprint.

Material Science

Chemical Engineering

Engineering