Study of creep parameters of thermal barrier coatings by bending creep tests

S. F. Wen, W. Z. Yan, G. Zhang, J. Liu, Z. F. Yue

Research output: Chapter in Book/Report/Conference proceedingConference contributionpeer-review

Abstract

The three-point bending creep testing on thermal barrier coatings (TBCs) has been investigated with the aim of determining the creep parameters of TBCs. In the present study, the thermal barrier coatings (TBCs) is described. It consists of a superalloy substrate (SUB layer) and a bond coat (BC layer) and a termal barrier coating (TBC layer). The most important is that the grown oxide (TGO layer) which between the TBC and BC is considered. The present study also shows how bending creep testing of material can be used to determine the creep parameters of a material. A method is explored to determine the creep parameters of TGO layer with bending creep testing. It is the reverse numerical procedure, which allows extracting the creep parameters on the basis of two bending creep tests with two positions of loading pin and a series of finite element calculations. Finally it is discussed how different frictions between the loading pin and the specimen affect bending creep behavior and how different thickness of TGO layer affects the veracity of the creep parameters which obtain from the bending creep testing.

Original languageEnglish
Title of host publicationProceedings of the 2nd International Conference on Modelling and Simulation, ICMS2009
Pages1-8
Number of pages8
StatePublished - 2009
Event2009 Joint International Conference on Modelling and Simulation - Manchester, United Kingdom
Duration: 21 May 200922 May 2009

Publication series

NameProceedings of the 2nd International Conference on Modelling and Simulation, ICMS2009
Volume6

Conference

Conference2009 Joint International Conference on Modelling and Simulation
Country/TerritoryUnited Kingdom
CityManchester
Period21/05/0922/05/09

Keywords

  • Bending creep testing
  • Creep parameters
  • Finite element analysis
  • Reverse numerical approach
  • TGO layer

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