Fingerprint
Dive into the research topics of 'Solidification mechanism transition of liquid Co-Cu-Ni ternary alloy'. Together they form a unique fingerprint.- Sort by
- Weight
- Alphabetically
Solidification mechanism transition of liquid Co-Cu-Ni ternary alloy
D. Y. Zang, H. P. Wang, F. P. Dai, D. Langevin, B. Wei
Research output: Contribution to journal › Article › peer-review