Fingerprint
Dive into the research topics of 'Simulation of the creep damage behavior of thin film/substrate systems by bending creep tests'. Together they form a unique fingerprint.- Sort by
- Weight
- Alphabetically
Simulation of the creep damage behavior of thin film/substrate systems by bending creep tests
S. F. Wen, W. Z. Yan, J. X. Kang, J. Liu, Z. F. Yue
Research output: Contribution to journal › Article › peer-review