Robust Ti₃C₂T_x MXene/starch derived carbon foam composites for superior EMI shielding and thermal insulation

Lightweight and robust electromagnetic interference (EMI) shielding materials are highly desirable in high-end precision electronic components and 5G communication system. Herein, the starch based porous carbon foam (PCF) is prepared by yeast fermentation, steam foaming and carbonization approach with flour as raw material. The Ti₃C₂T_x MXene/PCF (MPCF) composites are then fabricated via vacuum assisted impregnation of Ti₃C₂T_x MXene followed by freeze drying. The obtained PCF presents excellent compression strength and superior electrical properties. The compression strength and electrical conductivity (σ) of the PCF carbonized at 1400 °C are 4.9 MPa and 21.8 S/cm, respectively. The MPCF composites with 8.5 wt% Ti₃C₂T_x MXene exhibits superior EMI shielding effectiveness (EMI SE) and specific shielding effectiveness (SSE, EMI SE/ρ) of 75 dB and 216.9 dB cm³/g, respectively. Meanwhile, the MPCF composites possess excellent flame retardancy and outstanding heat insulation performances, and can be applied in the extreme environments. The resultant lightweight, robust and multifunctional MPCF composites with simple fabrication processes show broad application prospects for EMI shielding systems in aerospace, military engineering, electrical and electronics fields.