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Residual stress and interface debonding behavior in Si3N4w reinforced SiCN composites prepared by the PIP process: A case study
Mingxing Li, Ran Mo, Zeshui Xu, Jie Zhou, Conglin Zhang, Xuefeng Cui, Fang Ye, Laifei Cheng, Ralf Riedel
Research output: Contribution to journal › Article › peer-review