Preparation of high-tensile-ductility and high-conductivity alumina dispersion-strengthened copper via a cold spray additive manufacturing-friction stir processing composite process

The solid-state forming capabilities of cold spray additive manufacturing (CSAM) offer a new method for creating nano-reinforced materials. However, the interface of the deposits often fails to form strong metallurgical bonds, leading to mechanical defects that weaken the material. This study investigates the preparation of highly plastic nano-alumina dispersion-strengthened copper by combining CSAM with friction stir processing (FSP), both solid-state techniques. The results show that FSP treatment fuses the interfaces of the deposited particles, transforming the microstructure from multi-scale, elongated grains to a uniform ultrafine-grained (UFG) structure. The average grain size reduces from 3.1 μm to 0.86 μm, and the proportion of high-angle grain boundaries increases from 42.5 % to 85.2 %. This treatment significantly enhances both mechanical and electrical properties. The ultimate tensile strength increases from 210 MPa to 450 MPa, elongation at break improves from 1 % to 35 %, and electrical conductivity rises from 70 % IACS to 81 % IACS. These findings demonstrate the potential of the combined CSAM-FSP approach for producing high-performance nano-alumina dispersion-strengthened copper with superior mechanical and electrical properties.