Physical information neural network-based mechanical response prediction for sintered nano-silver materials

Xu Long, Xiaoyue Ding, Hongbin Shi, Yutai Su, Tang Gu

Research output: Chapter in Book/Report/Conference proceedingConference contributionpeer-review

Abstract

Deep learning approaches employing physics informed neural networks (PINNs) facilitate the modeling of agents and the analysis of mechanical properties in electronic packaging materials. Specifically, in the study of the mechanical behavior of sintered nano-silver materials, PINNs integrate momentum balance equations along with corresponding material constitutive models. The mechanical physics equations embedded in the PINN ensure that its output follows the laws of physics. The input data to the model are the coordinates of the position within the problem area, while the output data are the corresponding physical field components. Upon the completion of iterative training, the network effectively generates detailed displacement and stress-strain distributions for the material under displacement field loading. By embedding physical principles into the neural network, the accuracy and reliability of predictions for mechanical analysis are significantly enhanced, offering a robust framework for elucidating material behavior under diverse loading conditions.

Original languageEnglish
Title of host publicationProceedings of the 26th Electronics Packaging Technology Conference, EPTC 2024
EditorsSunmi Shin, Chin Hock Toh, Yeow Kheng Lim, Vivek Chidambaram, King Jien Chui
PublisherInstitute of Electrical and Electronics Engineers Inc.
Pages1052-1055
Number of pages4
ISBN (Electronic)9798331522001
DOIs
StatePublished - 2024
Event26th Electronics Packaging Technology Conference, EPTC 2024 - Singapore, Singapore
Duration: 3 Dec 20246 Dec 2024

Publication series

NameProceedings of the 26th Electronics Packaging Technology Conference, EPTC 2024

Conference

Conference26th Electronics Packaging Technology Conference, EPTC 2024
Country/TerritorySingapore
CitySingapore
Period3/12/246/12/24

Keywords

  • Deep learning
  • Electronic packaging materials
  • Physics principles
  • PINN
  • Sintered nano-silver

Fingerprint

Dive into the research topics of 'Physical information neural network-based mechanical response prediction for sintered nano-silver materials'. Together they form a unique fingerprint.

Cite this