Parametric finite element model of temperature/stress field evolution by metal laser solid forming

Liang Ma, Weidong Huang, Jun Yu, Bo Wang, Haiou Yang

Research output: Contribution to journalArticlepeer-review

11 Scopus citations

Abstract

Based on Ansys secondary development language APDL, a parametric temperature/stress finite element model for metal laser solid forming (MLSF) process was developed. The model allows for non-linear behavior of material properties, Gaussian distribution of laser energy, thermal convection and radiation boundary condition, phase change, free deformation constraints condition et al. A full finite element model of MLSF process is established by transition mesh technology. Accuracy of simulation is improved and the element number is reduced under the model. The temperature/stress evolution of MLSF process is simulated based on moving laser beam and element birth and death technology. On the basis of the temperature distribution is evolution, the reason of inducing the compress plastic stress, tensile plastic stress and unloading zones is analyzed. The influence of MLSF process conditions on temperature/stress can be studied by utilizing the parametric finite element model in order to optimize the MLSF process.

Original languageEnglish
Pages (from-to)3226-3232
Number of pages7
JournalZhongguo Jiguang/Chinese Journal of Lasers
Volume36
Issue number12
DOIs
StatePublished - Dec 2009

Keywords

  • Finite element simulation
  • Laser technique
  • Metal laser solid forming
  • Temperature/stress field

Fingerprint

Dive into the research topics of 'Parametric finite element model of temperature/stress field evolution by metal laser solid forming'. Together they form a unique fingerprint.

Cite this