@inproceedings{466cc2daf0bc4c888a886a88a66c3209,
title = "Numerical Study of Two-Stage-to-Obit Spacecraft Interstage Separation Mode",
abstract = "The design of the interstage separation mode of Two-Stage-to-Orbit (TSTO) spacecraft is very important. Numerical simulation can accurately predict the multi-body separation problem of fluid-structure coupling, such as stage separation. Coupled fluid control equations and rigid body motion equation, unstructured overset grid technology and dual-time method are used to solve the stage separation process of TSTO at Mach number 6 and altitude of 30 km. The motion characteristics and aerodynamic interference characteristics of the two stages are studied when the TSTO is separated at different angles of attack. The result shows that there will be strong aerodynamic interference between the two stages in the process of TSTO separation, which seriously affects the attitude control of the two stages and increases the risk. Compared with the separation at positive angle of attack, the separation of two stages at negative angle of attack has a larger distance and lower aerodynamic interference intensity, which is more favourable for the separation of the stages.",
keywords = "Hypersonic, Multibody separation, Numerical simulation, Overset grid, TSTO",
author = "Jiang, {Quan Feng} and Che, {Shi Qi} and Chen, {Shu Sheng} and Hua Yang and Zeng, {Pin Peng} and Jia, {Mu Liang} and Gao, {Zheng Hong}",
note = "Publisher Copyright: {\textcopyright} The Author(s), under exclusive license to Springer Nature Singapore Pte Ltd. 2024.; Asia-Pacific International Symposium on Aerospace Technology, APISAT 2023 ; Conference date: 16-10-2023 Through 18-10-2023",
year = "2024",
doi = "10.1007/978-981-97-4010-9_30",
language = "英语",
isbn = "9789819740093",
series = "Lecture Notes in Electrical Engineering",
publisher = "Springer Science and Business Media Deutschland GmbH",
pages = "405--419",
editor = "Song Fu",
booktitle = "2023 Asia-Pacific International Symposium on Aerospace Technology, APISAT 2023, Proceedings - Volume II",
}