Numerical and Experimental Investigations of the Thermal Fatigue Lifetime of CBGA Packages

Borui Yang, Jun Luo, Bo Wan, Yutai Su, Guicui Fu, Xu Long

Research output: Contribution to journalArticlepeer-review

8 Scopus citations

Abstract

A thermal fatigue lifetime prediction model of ceramic ball grid array (CBGA) packages is proposed based on the Darveaux model. A finite element model of the CBGA packages is established, and the Anand model is used to describe the viscoplasticity of the CBGA solder. The average viscoplastic strain energy density increment ∆Wave of the CBGA packages is obtained using a finite element simulation, and the influence of different structural parameters on the ∆Wave is analyzed. A simplified analytical model of the ∆Wave is established using the simulation data. The thermal fatigue lifetime of CBGA packages is obtained from a thermal cycling test. The Darveaux lifetime prediction model is modified based on the thermal fatigue lifetime obtained from the experiment and the corresponding ∆Wave. A validation test is conducted to verify the accuracy of the thermal fatigue lifetime prediction model of the CBGA packages. This proposed model can be used in engineering to evaluate the lifetime of CBGA packages.

Original languageEnglish
Pages (from-to)1113-1134
Number of pages22
JournalCMES - Computer Modeling in Engineering and Sciences
Volume130
Issue number2
DOIs
StatePublished - 2022

Keywords

  • Anand model
  • CBGA packages
  • Darveaux model
  • Finite element method
  • Lifetime prediction
  • Thermal fatigue

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